China Harvar Group will participate in the 28th China International Electronic Circuit Exhibition, which will be held in the National Convention and Exhibition Center from March 19 to 21, 2018, with booth No. 8.1 Hall 8G36.
The highlights of this exhibition are:
The world's leading basic silver process
1. the plating solution contains no nitric acid, no corrosion of copper wire and side erosion.
2. plating solution contains no corrosion inhibitor and osmosis agent.
3. the plating bath is a complete complexing system, and the silver layer is pure silver layer without carbon or organic matter.
4. when the pure silver layer is welded, there is no bubble inside the solder ball, and the welding strength is high.
5. plating solution can be plated for 1-5 minutes to ensure that the blind hole is completely plated with silver while not biting copper wire and side etching.
6. the plating solution is slightly alkaline, but it will not attack green paint. The pure silver layer has excellent anti tarnishing performance, so there is no need to waste sulfur free gloves and sulfur free paper.
China's leading horizontal copper deposition process
Direct electroplating of horizontal copper VS
1. hole metallized conductive substrate: copper, good electrical conductivity;
2. no electrolytic oxidation and reduction deposition;
3. no post microetching process was needed;
4. the medicine water system has long life and good conductivity.
Horizontal copper VS vertically sinks copper
1. the closed drug reaction system is more environmentally friendly.
2. sheet type board mode;
3. Drug penetration depends on equipment spraying, water knife and ultrasonic wave.
4. the process time is short;
5. the circulation speed of the drug is fast.
The 6. washing cycle is short.
It can be used for various FPC boards, R-flex&PCB and so on.
China's leading direct plating
1, do not use carcinogen formaldehyde, more environmentally friendly;
2, less water consumption, lower energy consumption, less waste generation, and more protection of the earth;
3, the quality is fully up to the IPC600 standard, and the price performance is high.
4. The unique equipment design is more suitable for high aspect ratio through hole technology.
5. The process flow is more suitable for fine line production.
6, more concise process steps, lower PCB manufacturing cost.
7. Use horizontal equipment to reduce operator's labor intensity and beautify the working environment.
8, the product used to replace cylinders for a long period of time, and the amount of fluid in the catalytic tank can reach 18m2/L or 30 days per liter.
Field activity
There will be wonderful lucky turnaround raffle and generous prizes.
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The number is limited, first come first! |
